The SPRINTER Project is pleased to highlight a new open-access publication from the Optoelectronic and Laser Technology Group (GOTL) at Universidad Carlos III de Madrid (UC3M), published in the International Journal of Microwave and Wireless Technologies.
The paper, entitled “Dielectric waveguide interconnects for hybrid mm-Waves and terahertz system integration,” presents compact and contactless interconnect solutions for substrateless all-silicon dielectric waveguides operating in the 220–330 GHz frequency range.
The research demonstrates a quarter-wave-matched (QWM) slot termination designed to improve coupling robustness in hybrid millimeter-wave and terahertz systems. By combining impedance matching with field redistribution through a compact slot geometry, the proposed approach makes all-silicon THz interconnects more tolerant to practical challenges such as fabrication variations, component placement, vibration, and thermal expansion.
These results contribute to the development of more reliable and practical high-frequency interconnection technologies, supporting the integration of advanced mm-wave and THz systems.
Congratulations to the authors Ashish Kumar, Muhsin Ali, Daniel Cabo Gallego, Alejandro Rivera, and Guillermo Carpintero on this achievement.
The work received support from several European and national initiatives, including the Horizon Europe Joint Undertaking projects SPRINTER, TERA6G and POLYNICES, as well as the Spanish national project MiBiLab, the Torres Quevedo programme, and the TERAcom-6G and EPIC-Pack projects supported through Spain’s UNICO I+D 5G-6G programme and NextGenerationEU.
Read the open-access publication here.